Embedded Files
✉ Scientific.syndicate@rediffmail.com | GSTIN: 36ABOPM8043J1Z6
What is Materials Science?
The interdisciplinary field of materials science, also commonly termed materials science and engineering, involves the discovery and design of new materials, with an emphasis on solids.Materials science is a syncretic discipline hybridizing metallurgy, ceramics, solid-state physics, and chemistry. It is the first example of a new academic discipline emerging by fusion rather than fission.
Product Name
CAS No.
Aluminium magnesium silicon alloy powder, APS <40 µm, 99%
Erbium Nickel alloy pellets
12018-93-8
Holmium Copper alloy
12018-93-8
Neodymium praseodymium alloy (75 : 25)
Copper bronze, powder
Chrome carbide, 50-100 μm, powder
Colmonoyy 6 powder, 45-105 µm
Colmonoyy 5 powder, 45-105um
Copper chromium zirconium plate 40 x 60 x 180 mm
CuCrZr rod, dia 55 mm length 50 cm
Copper tin alloy, Cu85Sn15
Devardas alloy
8049-11-4
Devardas alloy, GR
8049-11-4
Gold-Germanium alloy (88 % Au and 12 % Ge) 99.99%
Hastealloy N
Hastealloy X
Hastealloy X, powder
Hastelloy C276 wire, diam 1.0 mm, 99.9%
Inconel X750 wire, diam 1.0 mm, 99.9%
Iron chromium aluminum yttrium alloy powder
Mercury-thallium
Nickel aluminium alloy
12635-27-7
Nickel-chromium powder, 50-100 μm, 90%
11106-97-1
Nickel-boron master alloy (Ni: 83-85% and B: 14-16%) irregular particles, <15 mm, 99.9%
NiCoCrAlY powder
NdFeB magnet, N48
NdFeB magnet, N48H
Stainless steel, powder
65997-19-5
Stainless steel - SS316L, 50-100 μm, powder
Stellitee 21 powder, 53-150 µm
Stellitee 6 powder, 53-150um
Stainless steel - SS316L plate, 100 x 100 x 6 mm
Stainless steel - SS316L rod, dia x length 6 mm x 50 mm
Stainless steel - AISI 304, Fe/Cr18%/Ni 10%, plate, thickness 4.2 mm, size 1220 × 610 mm, temper annealed
Stainless Steel - AISI 430 alloy, Fe81Cr17MnSiCSP, plate, thickness 20 mm, size 500 × 500 mm, temper annealed
Stainless steel - AISI 304 rod, Fe/Cr18%/Ni 10%, 40 mm dia, length 1500 mm
Stainless steel - AISI 304 rod, Fe/Cr18%/Ni 10%, 120 mm dia, length 1000 mm
Stainless steel - AISI 316l, foil, Fe/Cr18%/Ni 10%/Mo 3%, thickness 1.2 mm, size 25 × 25 mm, temper annealed
Titanium-aluminium-vanadium alloy, foil, 150 x 150mm, 2.0 mm thick, annealed
Titanium aluminium carbide 211, ≥80%, ≤40 μm particle size
12537-81-4
Titanium alloy (Ti6Al4V) powder, 50-100 μm, 99.5%
99906-66-8
Cellulose acetate, average Mn ~50,000
9004-35-7
Cellulose acetate, average Mn ~30,000
9004-35-7
Cellulose DS-0, powder, suitable for thin layer chromatography (TLC)
9004-34-6
Cellulose acetate butyrate
9004-36-8
Cellulose acetate
9004-35-7
Cellulose acetate phthalate
9004-38-0
Cellulose, microcrystalline powder
9004-34-6
Cellulose powder, for column chromatography
9004-34-6
Cellulose microcrystalline, for TLC
9004-34-6
Antimony(III) sulphide, black, 95%
1345-04-06
Antimony(V) sulphide, golden
1315-04-04
Antimony(III) telluride, 99.99%
1327-50-0
Bismuth(III) telluride, - 350 mesh, 99.99%
1304-82-1
Bismuth antimony telluride, 99.99%
31501-07-02
Bismuth(III) telluride, 99.98%
1304-82-1
Cadmium zinc telluride, 99.99999%
Cadmium selenide, 99.999%
1306-24-7
Cadmium selenide, 99.99%
1306-24-7
Cadmium zinc telluride, 99.999%
Cadmium telluride, 99.999%
1306-25-8
Cadmium telluride, 99.99%
1306-25-8
Cadmium telluride pieces, 1-12 mm, 99.9999%
1306-25-8
Germanium telluride, 99.999%
12025-39-7
Lead(II) telluride 99.998%+
1314-91-6
Lead(II) telluride, 99.99%
1314-91-6
Silver(I) telluride
12002-99-2
Tin telluride, 99.999%
12040-02-07
Tetraammineplatinum(II) nitrate, 99.995% trace metals basis
20634-12-2
Tetraammineplatinum(II) nitrate, ≥50% Pt basis
20634-12-2
Zinc telluride, 99.99%
1315-11-3
Bathocuproine, GR 99%+
4733-39-5
Bathophenanthroline, GR 99%+
1662-01-07
Bathophenanthroline disulphonic acid disodium salt, GR 99%+
53744-42-6
Difluoro{2-[1-(3,5-dimethyl-2H-pyrrol-2-ylidene-N)ethyl]-3,5-dimethyl-1H-pyrrolato-N}boron, 99% (HPLC)
121207-31-6
Decanethiol, 96%
0143-10-2
2,5-Dihydroxyterephthalic acid, 98%
610-92-4
Germanium disulphide, 99%+
12025-34-2
Iodine pentoxide, GR 99%+
12029-98-0
Molybdenum disilicide, 99.8%
12136-78-6
Molybdenum disilicide, 40-60 μm, 99.9%
12136-78-6
Magnesium silicide, ≥99% trace metals basis, -20 mesh
22831-39-6
Molybdenum disilicide, 10-45 μm, 99.9%
12136-78-6
5-Nitro uracil, 99%
0611-08-05
Potassium tellurate, hydrate
314041-10-6
Silicon carbide sputtering target, diam. x thickness 1 inch × 3 mm, 99%
409-21-2
Silicon carbide, 0.1 - 5 µm, 99.9%
409-21-2
Silicone carbide 220 mesh
409-21-2
Silicone carbide 400 mesh
409-21-2
Silicone carbide, 99.9999%
409-21-2
Silicone carbide, ingot, N-type, diam. x thickness 3 in. x 15 mm
409-21-2
Silicone carbide, ingot, Semi-insulating, diam. x thickness 3 in. x 10 mm
409-21-2
Silicone carbide, ingot, N-type, diam. x thickness 2 in. x 10 mm
409-21-2
Titanium(IV) oxide, 99.995%
13463-67-7
Titanium(IV) oxide, 99.999%
13463-67-7
Tellurium oxide, 99.99%
7446-07-03
Tellurium oxide, 99%+
7446-07-03
Titanium dioxide, anatase powder, 99.8%
13463-67-7
Titanium dioxide, 99.9%
13463-67-7
Titanium dioxide, 99.99%
13463-67-7
Tellurium oxide, 99.995%
7446-07-03
Tellurium oxide, 99.5%
7446-07-03
Copper(II) phthalocyanine, 99%
147-14-8
Copper(II) phthalocyanine, 90%+
147-14-8
Cobalt(II) phthalocyanine, β-form, 97%
3317-67-7
Cresyl violet
18472-89-4
4-(Dicyanomethylene)-2-methyl-6-(4-dimethylaminostyryl)-4H-pyran, dye content 98%
51325-91-8
Iron(II) phthalocyanine, 90%
132-16-1
Iron(II) phthalocyanine, 97%
132-16-1
IR-806, dye content 90%
IR-783, Dye content 90%
115970-66-6
Magnesium phthalocyanine
1661-03-06
Nile Blue A perchlorate, dye content, 95 %
53340-16-2
Pyrromethene 650
157410-23-6
Pyrromethene 556
121461-69-6
Pyrromethene 567
131083-16-4
Pyrromethene 580
151486-56-5
Pyrromethene 597
137829-79-9
Rhodamine 640 perchlorate
72102-91-1
Rhodamine 19
62669-66-3
Rhodamine 110
116450-56-7
5,10,15,20-Tetraphenyl-21H, 23H-porphine zinc
14074-80-7
5,10,15,20-Tetraphenyl-21H,23H-porphine iron(III) chloride, 94%
16456-81-8
Zinc phthalocyanine, 97%
14320-04-08
Calcium hydride, 96%
7789-78-8
Allylpalladium(II) chloride dimer, 98%
12012-95-2
Boron silicide, 200 mesh, 98%
12008-29-6
Bismuth(III) selenide, - 350 mesh, 99.99%
12068-69-8
Boric acid, 99.97%
10043-35-3
Barium magnesium aluminate, europium doped, 99%
724792-82-9
Boric acid, 99.9995%
10043-35-3
meta-Boric acid, 99%
13460-50-9
Boric acid, 99.999%
10043-35-3
Cerium magnesium aluminate, terbium doped, 99%
106495-57-2
Cobalt(III) acetylacetonate, 98%
21679-46-9
2-(Dodecylthiocarbonothioylthio)-2-methylpropionic acid, 98% (HPLC)
461642-78-4
6,13-Diphenylpentacene, 98%
76727-11-2
1-Dodecanethiol, 98%
112-55-0
Dichlorodiphenylsilane, 97%
80-10-4
Fluosilicic acid
16961-83-4
Hexylphosphonic acid, 95%
4721-24-8
1-Hexanethiol, 97%
111-31-9
Hafnium tert-butoxide, 99%
2172-02-03
Hafnium tert-butoxide, 99.9%+
2172-02-03
Hexamethyldisilane, 98%
1450-14-2
Methyltrimethoxysilane, 98%
1185-55-3
(3-Mercaptopropyl) trimethoxysilane, 95%
4420-74-0
Molybdenum disulphide, ~6 μm, 99%
1317-33-5
Niobium diselenide, ≥99.9%
12034-77-4
Niobium boride, 99%
12007-29-3
Octadecylphosphonic acid, 97%
4724-47-4
Orthophosphoric acid, 85 wt.% in H2O, 99.99% trace metals basis
7664-38-2
Poly(acrylic acid, sodium salt) solution, average Mw ~1,200, 45 wt.% in H2O
9003-04-07
Poly(acrylic acid, sodium salt) solution, average Mw ~8,000, 45 wt.% in H2O
9003-04-07
Poly(acrylic acid, sodium salt) solution, average Mw ~15,000, 35 wt.% in H2O
9003-04-07
PSS-[3-(2-Aminoethyl)amino]propyl-Heptaisobutyl substituted
444315-16-6
Potassium tert-butoxide, 0.5 M in THF
865-47-4
Potassium tert-butoxide, puriss, 98%
865-47-4
Poly(dimethylsiloxane), hydroxy terminated viscosity ~750 cSt
70131-67-8
Poly(dimethylsiloxane), hydroxy terminated average Mn ~550, viscosity ~25 cSt
70131-67-8
Poly(dimethylsiloxane), hydroxy terminated viscosity ~65 cSt
70131-67-8
Poly(dimethylsiloxane), hydroxy terminated average Mn ~110,000, viscosity ~50,000 cSt
70131-67-8
Polycarbomethylsilane, average Mw ~1500-2000
62306-27-8
Polycarbomethylsilane, average Mw ~1500-2200
62306-27-8
Polycarbomethylsilane, average Mw ~1500-2500
62306-27-8
Poly(dimethylsilylene)
28883-63-8
Poly(ethylene glycol) methyl ether methacrylate, average Mn 500
26915-72-0
Poly(ethylene glycol) methyl ether methacrylate, average Mn 950
26915-72-0
Phosphoric acid crystalline, ≥99.999% trace metals basis
7664-38-2
Poly(dimethylsiloxane), hydroxy terminated viscosity ~10000-15000 cSt
70131-67-8
Ruthenium(IV) oxide hydrate, 99.99%
32740-79-7
Stannic oxide, 99%
18282-10-5
Stannic oxide, GR 99%+
18282-10-5
Sodium phenoxide, 98%
0139-02-06
Stannic oxide, 99.9%
18282-10-5
Triethoxymethylsilane, 99%
2031-67-6
Tetradecylphosphonic acid, 97%
4671-75-4
Titania paste, transparent
Telluric acid, 99%+
7803-68-1
Triphenylarsine oxide, 98%
1153-05-05
Trichloro(1H,1H,2H,2H-perfluorooctyl)silane, 97%
78560-45-9
Zinc acetate, 99.99%
5970-45-6
Zinc acetate, ≥99%
5970-45-6
Zinc selenide, 99.99%
1315-09-09
Zinc acetate dihydrate ACS reagent, ≥98%
5970-45-6
Zinc acetate, 99.999%
5970-45-6
Poly(methyl)methacrylate Microparticles [Mean Diameter (µm) 0.915]
Poly(methyl)methacrylate Microparticles [Mean Diameter (µm) 0.350]
Poly(methyl)methacrylate Microparticles [Mean Diameter (µm) 0.286]
Poly(methyl)methacrylate Microparticles [Mean Diameter (µm) 0.196]
Polystyrene Microparticles [Mean Diameter (µm) 0.172]
Polystyrene Microparticles [Mean Diameter (µm) 0.287]
Poly(methyl)methacrylate Microparticles [Mean Diameter (µm) 1.98]
Poly(methyl)methacrylate Microparticles [Mean Diameter (µm) 4.97]
Poly(methyl)methacrylate Microparticles [Mean Diameter (µm) 8.13]
Poly(methyl)methacrylate Microparticles [Mean Diameter (µm) 0.350]
Poly(methyl)methacrylate Microparticles [Mean Diameter (µm) 0.520]
Polystyrene Microparticles [Mean Diameter (µm) 0.304]
Polystyrene Microparticles [Mean Diameter (µm) 1.02]
Polystyrene Microparticles [Mean Diameter (µm) 0.518]
Polystyrene Microparticles {Green-Fluorescent} [Mean Diameter (µm) 0.253]
Polystyrene Microparticles {Green-Fluorescent} [Mean Diameter (µm) 0.293]
Polystyrene Microparticles Red-Fluorescent [Mean Diameter (µm) 0.250]
Polystyrene Microparticles {Rhodamine-B dye doped} [Mean Diameter (µm) 0.290]
Polystyrene Microparticles {Rhodamine-B dye doped} [Mean Diameter (µm) 0.319]
Silica Microparticles [Mean Diameter (µm) 0.177]
Silica Microparticles [Mean Diameter (µm) 0.304]
Silica Microparticles [Mean Diameter (µm) 0.351]
Silica Microparticles [Mean Diameter (µm) 0.560]
Silica Microparticles [Mean Diameter (µm) 0.977]
Polystyrene Microparticles Red-Fluorescent [Mean Diameter (µm) 0.470]
Polystyrene Microparticles {Rhodamine-B dye doped} [Mean Diameter (µm) 0.302]
Silica, nanoparticle dispersion in water, <30 nm (DLS), triethoxylpropylaminosilane functionalized
PCDTBT
958261-50-2
Polyphenylene sulphide, brown
25212-74-2
Polyphenylene sulphide, black
25212-74-2
Spiro-MeOTAD, 99%
207739-72-8
Carbon felt, 3.18mm thick, 99%
Carbon black, acetylene, 50% compressed, 99.9%+
1333-86-4
Carbon black, acetylene, 100% compressed, 99.9%+
1333-86-4
Diamond powder, 50 μm
7782-40-3
Diamond powder, 0-1 μm
7782-40-3
Graphite nanopowder flakes, D50 : 400 nm, 99.9%
7782-42-5
Graphite powder, <20 μm, synthetic
7782-42-5
Graphite nanofibers, 200-500 nm
7782-42-5
Graphite foil, 1 mm thick , 99.8%
7782-42-5
Graphite fine powder, 98%
7782-42-5
Graphite flakes, 99% carbon basis, +200 mesh particle size (≥70%), natural
7782-42-5
Graphite flakes, 99% carbon, −100 mesh (≥80%), natural
7782-42-5
Graphite flakes, 99% carbon basis, +50 mesh particle size (≥80%), natural
7782-42-5
Graphite flakes, ≥94% carbon
7782-42-5
Graphite, irregular particles, <10 mm, 99.5%
7782-42-5
Graphite rod, diam. × length 3 mm x 150 mm, 99.999%
7782-42-5
Graphite rod, diam. × length 6 mm x 150 mm, 99.999%
7782-42-5
Hafnium powder, <40 μm, 99.9%
7440-58-6
Hafnium pieces, 2-3 mm, 99.9%
7440-58-6
Hafnium pieces, 4-10 mm, 99.9%
7440-58-6
Hafnium powder, -325 mesh, 99.6% (metals basis excluding Zr), Zr nominal 2-3.5%
7440-58-6
Hafnium, thermal spray grade, -325 mesh powder, 99%
7440-58-6
Hafnium pellets, 3 mm dia x 3 mm th., 99.95%
7440-58-6
Hafnium pellets, dia.3 x 3 mm, 99.9%
7440-58-6
Inconel 625 alloy powder
Strontium, granular, 99.99%
7440-24-6
Sulphur pellets, 12-13 mm dia, 1.85-1.88 mm thick, 99.99%
7704-34-9
Sulphur pellets, 18-25 mm dia, 3 -5 mm thick, 99.99%
7704-34-9
Strontium, 99.9%
7440-24-6
Strontium pieces, 99%
7440-24-6
Sulphur powder, 99.98%
7704-34-9
Sulphur powder, 98%
7704-34-9
Sulphur powder, spectroscopically pure, 99.99%
7704-34-9
Sulphur powder, GR 99%+
7704-34-9
Sulphur powder, 99.999%
7704-34-9
Sulphur powder, 99.5%
7704-34-9
Inconel 718 alloy powder, 50-100 μm, 90%
Thallium granules, 6mm (0.2in) & down, 99.99% (metals basis)
7440-28-0
Thallium powder, 99.999%
7440-28-0
Thullium powder, 99.9%
7440-30-4
(Aminoethylaminomethyl)phenethyltrimethoxysilane [mixture of m and p isomers]
74113-77-2
3-(2-Aminoethylamino)propyltrimethoxysilane, 90%
1760-24-3
3-(2-Aminoethylamino)propyltrimethoxysilane, 97%
1760-24-3
Isobutyltrimethoxysilane, 97%
18395-30-7
n-Octadecyltrichlorosilane, 95%
0112-04-09
1H,1H,2H,2H-Perfluorooctyltriethoxysilane, 97%
51851-37-7
Poly(3,4-ethylenedioxythiophene)-poly(styrenesulfonate) dry re-dispersible pellets
1H,1H,2H,2H-Perfluorodecyltrichlorosilane, 95%+
78560-44-8
Triethoxyvinylsilane, 99%
78-08-0
Trimethoxy(3,3,3-trifluoropropyl)silane, 97%
429-60-7
Fluorine doped tin oxide coated glass slide L × W × D 100 mm × 100 mm × 2.3 mm, surface resistivity ~7 Ω/sq
Fluorine doped tin oxide (FTO) coated glass substrates, L × W × thickness 50 mm x 50 mm x 2.2 mm
Fluorine doped tin oxide coated glass slide L × W × D 300 mm × 300 mm × 2.2 mm, surface resistivity ~7 Ω/sq
Single crystal sapphire substrates L × W × thickness 25 mm × 25 mm × 0.5 mm
Aluminium oxide substrate, polycrystalline, 96%, L × W × thickness 10 mm × 10 mm × 0.5 mm
1344-28-1
Aluminium oxide substrate, polycrystalline, 96%, L × W × thickness 25.4 mm × 25.4 mm × 0.5 mm
1344-28-1
Aluminium oxide single crystal substrate, Orientation: <0001>+/-0.3degree, Size: 10 x 10 x 1.0 mm,
1344-28-1
Aluminium oxide single crystal substrate, Orientation: <11-20>+/-0.3degree, Size: 10 x 10 x 1.0 mm
1344-28-1
Aluminium oxide single crystal substrate, <0001>
1344-28-1
Aluminium oxide single crystal substrate, <0001>, (C-Plane, 10 x 10 x 0.5 mm)
1344-28-1
Aluminium oxide (Substrate N type) (GaN templates), 10 x 10mm, Orientation (0001)
1344-28-1
Aluminium oxide (substrate) 10 x 10 x 0.5 mm, Orientation (10-10)
1344-28-1
Gallium Gadolinium Garnet, single crystal substrates, 10mm x 10mm x 0.5mm, <100>
Gallium oxide, single crystal substrates, 10 mm x 10 mm x 0.6 mm, <100>
12024-21-4
Indium tin oxide coated, glass substrate, Size: 10 x 10 x 1 mm
50926-11-9
Indium oxide coated PET surface resistivity ≤10 Ω/sq, slide
Indium tin oxide coated, glass substrate, 25 x 25 x 0.7 mm
50926-11-9
Indium tin oxide coated, glass substrate, 10 x 10 x 0.7 mm3
50926-11-9
Indium tin oxide coated, glass substrate, 20 x 20 x 1 mm
50926-11-9
Indium tin oxide coated glass slide, rectangular (surface resistivity 70-100 Ω/sq, slide)
50926-11-9
Indium tin oxide coated, glass substrate, 100 x 100 x 1.1 mm
50926-11-9
LSAT single crystal substrate, 10 x 10 x 0.5 mm, Orientation <100>, 99.9%+
LSAT single crystal substrate (single side polished), <100>, 10 x 10 x 0.5 mm
LSAT single crystal substrate, 10 x 10 x 0.5 mm, Orientation <100>, 99.99%
LSAT single crystal substrate, 10 x 10 x 0.5 mm, Orientation <111>, 99.99%
Magnesium oxide, (single crystal substrate), 10 x 10 x 1.0 mm, Orientation : < 100>+/-0.3degree
1309-48-4
Magnesium oxide (single crystal substrate), ≥99.9% trace metals basis, <111>, L × W × thickness 10 mm × 10 mm × 1 mm
1309-48-4
Magnesium oxide, (single crystal substrate), <100>
1309-48-4
Magnesium oxide, (single crystal substrate), 10 x 10 x 0.2 mm, Orientation <100>
1309-48-4
Magnesium oxide, (single crystal substrate), 10 x 10 x 0.5 mm, Orientation <111>
1309-48-4
Magnesium oxide (single crystal substrate), <100>, ≥99.9% trace metals basis, L × W × thickness 10 mm × 10 mm × 0.2 mm
1309-48-4
Magnesium aluminate, single crystal substrates, 10 mm × 10 mm × 0.5 mm
12068-51-8
Magnesium oxide (single crystal substrate), <100>, ≥99.9% trace metals basis, L × W × thickness 10 mm × 10 mm × 0.5 mm
1309-48-4
Magnesium oxide, (single crystal substrate), 10 x 10 x 0.5 mm, Orientation <100>, 99.99%
1309-48-4
Magnesium oxide (single crystal substrate), <100>, ≥99.9% trace metals basis, L × W × thickness 10 mm × 10 mm × 0.5 mm
1309-48-4
Magnesium oxide (single crystal substrate), ≥99.9% trace metals basis, <100>, L × W × thickness 10 mm × 10 mm × 0.5 mm
1309-48-4
Magnesium oxide wafer, <100>, diam. × thickness 2 in x 0.5 mm
1309-48-4
Quartz single crystal substrate, <0001>
60676-86-0
Strontium titanium oxide substrate, 10 mm x 10 mm x 0.5 mm, polished one side, <100> orientation, 99.99%
12060-59-2
Silicon wafer (single substrase), <100>, p-type, contains Boron as dopant, diam. × thickness 2 inch x 0.3 mm
7440-21-3
Silicon wafer (single substrase), <100>, n-type, contains Phosphorus as dopant, diam. × thickness 2 inch x 0.3 mm
7440-21-3
Silicon wafer (single substrase), <100>, p-type, contains Boron (B) as dopant, size × thickness 125 mm × 125 mm × 0.2 mm
7440-21-3
Silicon wafer (single substrase), <111>, p-type, contains Boron (B) as dopant, diam. × thickness 2 in. × 0.1 mm
7440-21-3
Silicon wafer (single substrase), <100>, p-type, contains Boron (B) as dopant, diam. × thickness 2 in. × 0.1 mm
7440-21-3
Silicon wafer (single substrase), <100>, n-type, contains Arsenic as dopant, diam. × thickness 4 in. × 0.2 mm
7440-21-3
Silicon wafer (single side polished), <111>, P-type, diam. x thickness 2 in x 285 µm
7440-21-3
Silicon wafer (single side polished), <100>, P-type, diam. x thickness 2 in x 285 µm
7440-21-3
Sapphire substrates, <0001>, L × W × thickness 10 mm × 10 mm × 0.5 mm
Silicon carbide (4H-SiC) wafers, dia 100 mm, thick 1.0 mm
409-21-2
Silicon carbide (4H-SiC) wafers, dia 100 mm, thick 1.5 mm
409-21-2
Strontium titanate single crystal substrate 10 x 10 x 1.0 mm, <100>
12060-59-2
Strontium titanate single crystal substrate, Orientation :< 100>+/-0.3degree, Size: 10 x 10 x 1.0 mm
12060-59-2
Strontium titanium oxide substrate, 10 mm x 10 mm x 0.5 mm, polished one side, <111> orientation, 99.99%
12060-59-2
Silicon carbide substrates (N-Type SiC), <0001> dimensions. × thickness 10 x 10 mm × 0.3 mm
409-21-2
Silicon carbide (4H-SiC) wafers, dia 76.2 mm, thick 0.35 mm
409-21-2
Strontium titanium oxide substrate, L × W × thickness 10 mm × 10 mm × 0.5 mm
12060-59-2
Strontium titanium oxide substrate, <111>, 10 mm x 10 mm x 5 mm
12060-59-2
Silicon carbide (4H-SiC Epitaxial Wafer) wafers, dia 101 mm, thick 0.35 mm
409-21-2
Silicon wafer (single substrase), <100>, p-type, contains Boron (B) as dopant, diam. x thickness 100 mm x 0.525 mm
7440-21-3
Silicon wafer (single substrase), <100>, N-type, contains phosphorus (Ph) as dopant, diam. x thickness 100 mm x 0.525 mm
7440-21-3
Silicon wafer, <100>, p-type, contains Boron (B) as dopant, diam. x thickness 150 mm x 320 μm
Strontium titanium oxide wafer, <100>, diam. × thickness 1 in x 0.5 mm
12060-59-2
Yttrium-Stabilized Zirconia, single crystal substrates, 10mm x 10mm x 0.5mm, <100>
Yttrium-Stabilized Zirconia single crystal substrates, 10mm x 10mm x 0.5mm, <111>
Zirconium oxide, yttrium oxide, single crystal, L × W × thickness 10 mm × 10 mm × 0.5 mm
ZrO2 Y substrate, <100>
Aluminium sputtering target, diam. x thickness 50.6 mm × 3 mm, 99.99%
7429-90-5
Aluminium oxide sputtering target, diam. x thickness 4 inch x 6 mm, 99.99%
1344-28-1
Aluminium sputtering target, diam. x thickness 50.8 mm × 3 mm, 99.99%
7429-90-5
Aluminium sputtering target, diam. x thickness 3 inch × 2 mm, 99.95%
7429-90-5
Aluminium sputtering target, diam. x thickness 50 mm × 5 mm, 99.99%
7429-90-5
Aluminium sputtering target, diam. x thickness 3 inch × 3 mm, 99.99%
7429-90-5
Antimony sputtering target, diam. × thickness 2 inch × 0.125 inch, 99.999%, with bonded Copper (Cu) backing plate of thickness 3 mm
7440-36-0
Aluminium sputtering target 99.99%, (L x W x Thick 200 x 125 x 3 mm)
7429-90-5
Aluminium zinc oxide sputtering target, diam. × thickness 50.8 mm × 3 mm
37275-76-6
Boron sputtering target, diam. x thickness 4 inch × 3 mm, ≥99.9%
7440-42-8
Boron sputtering target, 25 mm x 25 mm x 2 mm th., ≥99.5%
7440-42-8
Boron sputtering target, diam. x thickness 30 mm × 10 mm, ≥99.9%
7440-42-8
Boron sputtering target, diam. x thickness 76.2 mm × 3.18 mm, ≥99.95%
7440-42-8
Boron sputtering target bonded with Indium (In) dia x thickness 2 inch × 3 mm, ≥99.9%
Bismuth selenide, sputtering target, diam. × thickness 3 inch × 3 mm, 99.95%
12068-69-8
Bismuth selenide doped with manganese, sputtering target, diam. × thickness 3 inch × 3 mm, 99.95% (5 wt% Mn)
12068-69-8
Bismuth selenide doped with copper, sputtering target, diam. × thickness 3 inch × 3 mm, 99.95% (5 wt% Cu)
12068-69-8
Bismuth selenide doped with iron, sputtering target, diam. × thickness 3 inch × 3 mm, 99.95% (5 wt% Fe)
12068-69-8
Bismuth selenide doped with cobalt, sputtering target, diam. × thickness 3 inch × 3 mm, 99.95% (5 wt% Co)
12068-69-8
Bismuth selenide doped with chromium, sputtering target, diam. × thickness 3 inch × 3 mm, 99.95% (5 wt% Cr)
12068-69-8
Bismuth selenide doped with nickel, sputtering target, diam. × thickness 3 inch × 3 mm, 99.95% (5 wt% Ni)
12068-69-8
Bismuth selenide, sputtering target, diam. × thickness 1 inch × 3 mm, 99.95%
12068-69-8
Bismuth selenide doped with manganese, sputtering target, diam. × thickness 1 inch × 3 mm, 99.95% (5 wt% Mn)
12068-69-8
Bismuth selenide doped with copper, sputtering target, diam. × thickness 1 inch × 3 mm, 99.95% (5 wt% Cu)
12068-69-8
Bismuth selenide doped with iron, sputtering target, diam. × thickness 1 inch × 3 mm, 99.95% (5 wt% Fe)
12068-69-8
Bismuth selenide doped with cobalt, sputtering target, diam. × thickness 1 inch × 3 mm, 99.95% (5 wt% Co)
12068-69-8
Bismuth selenide doped with chromium, sputtering target, diam. × thickness 1 inch × 3 mm, 99.95% (5 wt% Cr)
12068-69-8
Bismuth selenide doped with nickel, sputtering target, diam. × thickness 1 inch × 3 mm, 99.95% (5 wt% Ni)
12068-69-8
Bismuth selenide, sputtering target, diam. × thickness 2 inch × 3 mm, 99.99%
12068-69-8
Cobalt sputtering target, diam. x thickness 50.6 mm x 3 mm, 99.99%
7440-48-4
Chromium sputtering target, diam. × thickness 50 mm × 5 mm, 99.99%
7440-47-3
Copper sputtering target, diam. x thickness 2 inch x 3 mm, 99%
7440-50-8
Chromium sputtering target, diam. × thickness 3 inch × 6 mm, 99.95%
7440-47-3
Chromium sputtering target, diam x thickness 2 inch × 1.5 mm, ≥99.95%
7440-47-3
Copper sputtering target, diam. x thickness 50.6 mm x 3 mm, 99.99%
7440-50-8
Chromium sputtering target, diam. × thickness 2 inch × 3 mm, 99.99%
7440-47-3
Copper sputtering target, diam. x thickness 50.8 mm x 3 mm, 99.99%
7440-50-8
Chromium sputtering target, diam. × thickness 3 inch × 2 mm, 99.95%
7440-47-3
Chromium sputtering target, diam. x thickness 50.6 mm x 3 mm, 99.99%
7440-47-3
CrSi 91.1/8.9at% target, 50.8 mm dia. x 5 mm thick, 99.9% (Indium bonded to 1 mm thick copper backing plate)
Chromium sputtering target, diam. × thickness 2 inch × 3 mm, 99.9%
7440-47-3
Cobalt sputtering target, diam. x thickness 50.8 mm x 1 mm, 99.95%
7440-48-4
Copper sputtering target, diam. x thickness 50 mm x 5 mm, 99.99%
7440-50-8
Cobalt sputtering target 99.95% 3 inch dia x 2 mm thick
Copper sputtering target, diam. x thickness 3 inch x 3 mm, 99.99%
7440-50-8
Copper sputtering target, diam. × thickness 2 inch × 0.25 inch, 99.995%
7440-50-8
Cobalt sputtering target, diam. x thickness 25.4mm (1.0in) x 1 mm , 99.9%
7440-48-4
Cobalt sputtering target, diam. x thickness 4 inch x 4 mm, 99.99%
7440-48-4
Copper sputtering target, diam. × thickness 2 inch × 0.125 inch, 99.99%
7440-50-8
Cobalt sputtering target, diam. x thickness 2 inch x 1 mm, 99.99%
7440-48-4
Copper sputtering target, diam. x thickness 25.4 mm x 1 mm, 99.9%
7440-50-8
Co76Si14B10 alloy sputtering target dia x thickness 2 inch × 1.5 mm, ≥99.9%
Fe33.3Co33.3Ni33.3 sputtering target 99.95%3 inch dia x 2 mm thick
Fe50Co50 sputtering target 99.95% 3 inch dia x 2 mm thick
FeCo alloy sputtering target diam. x thickness 2 inch × 1.5 mm, ≥99.9%
Fe88Ga17 sputtering target 99.95% 3 inch dia x 2 mm thick
Fe38 Co38Si14B10 alloy sputtering target dia x thickness 2 inch × 1.5 mm, ≥99.9%
Fe75Ga25 sputtering target 99.95% 3 inch dia x 2 mm thick
Fe76Si14B10 alloy sputtering target dia x thickness 2 inch × 1.5 mm, ≥99.9%
Fe40Co40B20 alloy sputtering target diam. x thickness 2 inch × 1.5 mm, ≥99.9%
Gold sputtering target, diam. × thickness 50.8 mm × 6 mm, 99.99%
7440-57-5
Gold sputtering target, diam. × thickness 2 inch × 0.25 inch, 99.99%
7440-57-5
Gold sputtering target, diam. × thickness 2 inch × 0.125 in, 99.99%
7440-57-5
Gold sputtering target, diam. × thickness 2 inch × 3 mm, 99.99%
7440-57-5
Gold sputtering target, diam. × thickness 50 mm × 1 mm, 99.99%
7440-57-5
Gold sputtering target, diam. × thickness 50 mm × 2 mm, 99.99%
7440-57-5
Gold sputtering target, diam. × thickness 3 inch dia x 0.5 mm, 99.95%
7440-57-5
Gold sputtering target, diam. × thickness 50.8 mm × 3 mm, 99.99%
7440-57-5
Gold sputtering target, diam. × thickness 100 mm × 6 mm, 99.99%
7440-57-5
Gold sputtering target, diam. × thickness 57 mm × 0.3 mm, 99.9%
7440-57-5
Gold sputtering target, diam. × thickness 5 cm × 0.5 mm, 99.99%
7440-57-5
Gold sputtering target, diam. × thickness 2 inch × 0.3 mm, 99.99%
7440-57-5
G 5679
Gold sputtering target, diam. × thickness 57 mm × 0.1 mm, 99.9%
7440-57-5
Gold sputtering target, diam. × thickness 100 mm × 4 mm, 99.9%
7440-57-5
Gold sputtering target, diam. × thickness 57 mm × 0.2 mm, 99.99%
7440-57-5
Gold sputtering target, diam. × thickness 57 mm × 0.1 mm, 99.99%
7440-57-5
Gold sputtering target, diam. × thickness 2 inch × 2 mm, 99.99%
7440-57-5
Gold sputtering target, diam. × thickness 2 inch × 1.5 mm, 99.9%
7440-57-5
Gold sputtering target, diam. × thickness 3 inch × 1.5 mm, 99.9%
7440-57-5
Germanium antimony telluride, sputtering target, diam. x thickness 2 inch x 0.125 inch, 99.99%
243854-63-9
Gold sputtering target, diam. × thickness 25.4 mm × 0.2 mm, 99.99%
7440-57-5
Gold sputtering target, diam. × thickness 101.6 mm × 4 mm, 99.9%
7440-57-5
Hafnium sputtering target, diam. x thickness 50.6 mm x 3 mm, 99.99%
7440-58-6
Hafnium foil, 3 mm thick, 99.9%
7440-58-6
Hafnium foil, 0.05 mm thick, 99.9%
7440-58-6
Hafnium sputtering target dia x thickness 2 inch × 0.125 inch, ≥99.95%
7440-58-6
Hafnium sputtering target dia x thickness 2 inch × 2 mm, ≥99.95%
7440-58-6
Iron sputtering target, diam. x thickness 2 inch x 1 mm, 99.99%
7439-89-6
Iron sputtering target, diam. x thickness 50.8 mm x 0.75 mm, 99.95%
7439-89-6
Indium sputtering target, diam. x thickness 25.4mm (1.0in) x 1 mm , 99.9%
7440-74-6
Iron sputtering target, diam. x thickness 50 mm x 6 mm, 99.99%
7439-89-6
Iron sputtering target, diam. x thickness 50.6 mm x 3 mm, 99.99%
7439-89-6
Indium tin oxide sputtering target, diam. x thickness 4 inch × 10 mm, 99.99%
50926-11-9
Iron sputtering target, diam. x thickness 4 inch x 6 mm, 99.9%
7439-89-6
Indium sputtering target, diam. x thickness 50.6 mm x 3 mm, 99.99%
7440-74-6
Indium sputtering target, diam. x thickness 50 mm x 6 mm, 99.99%
7440-74-6
Iron sputtering target 99.95% 3 inch dia x 2 mm thick
Iron sputtering target, diam. x thickness 25.4 mm x 1 mm, 99.9%
7439-89-6
Ir80Mn20 sputtering target 99.95% 3 inch dia x 1.5 mm thick
Lutetium sputtering target, diam. x thickness 76.2 mm × 3 mm, 99%
7439-94-3
Lithium phosphate sputtering target, dia x thickness 3 inch x 3 mm, 99.99%
10377-52-3
Lutetium sputtering target, diam. x thickness 75 mm × 3 mm, 99.9%
7439-94-3
Lutetium sputtering target, diam. x thickness 55 mm × 3 mm, 99.99%
7439-94-3
Lutetium sputtering target, diam. x thickness 55 mm × 3 mm, 99.9%
7439-94-3
Magnesium oxide sputtering target dia x thickness 2 inch × 2 mm, ≥99.9%
1309-48-4
Molybdenum sputtering target, diam. x thickness 50.6 mm x 3 mm, 99.99%
7439-98-7
Molybdenum sputtering target, diam. x thickness 50.8 mm x 3.125 mm, 99.95%
7439-98-7
Magnesium sputtering target, diam. x thickness 50.6 mm x 3 mm, 99.99%
7439-95-4
Manganese sputtering target, diam. x thickness 50.6 mm x 3 mm, 99.99%
7439-96-5
Magnesium oxide sputtering target dia x thickness 3 inch × 2 mm, ≥99.95%
1309-48-4
Mn3Ga sputtering target 99.95% 3 inch dia x 1.5 mm thick
Molybdenum sputtering target, diam. x thickness 25.4 mm x 1 mm, 99.9%
7439-98-7
Magnesium sputtering target, diam. x thickness 25.4mm (1.0in) x 1 mm , 99.9%
7439-95-4
Molybdenum sputtering target, diam. x thickness 3 inch x 3 mm, 99.99%
7439-98-7
Molybdenum sputtering target, diam. x thickness 4 inch x 4 mm, 99.99%
7439-98-7
Molybdenum sputtering target, diam. x thickness 3 inch x 2.5 mm, 99.95%
7439-98-7
Manganese sputtering target, diam. x thickness 25.4 mm x 1 mm, 99.9%
7439-96-5
Niobium, sputtering target, 99.95% (L x W x Thick 14 x 1 x 2 mm)
7440-03-01
Nickel sputtering target, diam. x thickness 50.6 mm x 3 mm, 99.99%
7440-02-0
Niobium nitride sputtering target, diam. x thickness 4 inch x 6 mm, 99.5%
24621-21-4
Ni80Cr20 sputtering target 99.95% 3 inch dia x 2 mm thick
Ni80Fe20 sputtering target 99.95% 3 inch dia x 2 mm thick
Nickel oxide, sputtering target, diam. x thickness 2 inch x 0.125 inch, 99.9%
1313-99-1
Nickel sputtering target, diam. x thickness 4 inch x 4 mm, 99.99%
7440-02-0
Nickel sputtering target, diam. x thickness 3 inch dia x 2.5 mm, 99.95%
7440-02-0
Nickel oxide, sputtering target, diam. x thickness 3 inch x 1.5 mm, 99.9%
1313-99-1
Niobium Tin sputtering target, diam. x thickness 3 inch × 0.25 inch, 99.9%
Nickel sputtering target, diam. x thickness 25.4 mm x 1 mm, 99.9%
7440-02-0
Nickel sputtering target dia x thickness 2 inch × 1.5 mm, ≥99.99%
7440-02-0
Palladium sputtering target, 99.95% (L x W x Thick 14 x 1 x 2 mm)
7440-05-03
Praseodymium sputtering target, diam. x thickness 50.6 mm x 3 mm, 99.99%
7440-10-0
Platinum sputtering target, diam. × thickness 57 mm × 0.1 mm, 99.9%
7440-06-04
Platinum sputtering target, dia 1 inch x 1 mm thick, 99.99%
7440-06-04
Platinum sputtering target, 99.99% (bonded with Copper backing plate)
7440-06-04
Platinum sputtering target, dia 3 inch x 0.5 mm thick, 99.95%
7440-06-04
Platinum sputtering target, diam. × thickness 2 in. × 2 mm, 99.99%
7440-06-04
Platinum sputtering target, dia 1 inch x 1 mm thick, 99.95%
7440-06-04
Platinum sputtering target, dia 2 inch x 2 mm thick, 99.95%
7440-06-04
Palladium sputtering target, dia. x thickness 2.00" x 0.125", 99.995%
7440-05-03
Platinum sputtering target, dia 2 inch x 2 mm thick, 99.99%
7440-06-04
Platinum sputtering target, dia 1 inch x 2 mm thick, 99.99%
7440-06-04
Palladium sputtering target, diam. x thickness 3 inch × 0.5 mm, 99.99%
7440-05-03
Palladium sputtering target, diam. x thickness 2 inch × 1 mm, 99.99%
7440-05-03
Platinum sputtering target, diam. × thickness 2 in. × 1 mm, 99.9%
7440-06-04
Platinum sputtering target, dia 57 mm x 0.1 mm thick, 99.9%
7440-06-04
Platinum sputtering target, diam. × thickness 2 inch × 0.7 mm, 99.99%
7440-06-04
Palladium silver alloy sputtering target, diam. × thickness 50.8 × 3 mm, 99.99%
Platinum sputtering target, 50.8mm (2.0in) dia x 1.6 mm (0.063 in) thick, 99.99%
7440-06-04
Palladium silver alloy sputtering target, (L x W x thick 700 x 25.4 x 2 mm), 99.95%
Ruthenium sputtering target dia x thickness 2 inch × 1 mm, ≥99.9%
Ruthenium sputtering target 3 inch dia x 1 mm thick, 99.95%
7440-18-8
Ruthenium sputtering target 3 inch dia x 2 mm thick, ≥99.95%
7440-18-8
Silicon sputtering target, diam. × thickness 50 mm × 6 mm, 99.99%
7440-21-3
Silver sputtering target, diam. × thickness 3 inch × 3 mm, 99.99%
7440-22-4
Silicon carbide sputtering target, diam. x thickness 4 inch x 6 mm, 99.5%
409-21-2
Silicon sputtering target, diam. × thickness 2 inch × 3 mm, 99.999%
7440-21-3
Silicon dioxide sputtering target, diam. x thickness 304.8 mm x 10 mm, 99.99% elastomer bonding to Copper backing plate 304.8mm dia x 16 mm thick
14808-60-7
Silicon sputtering target (with back plate), diam. x thickness 4 inch x 4 mm, 99.99%
7440-21-3
Silver sputtering target, diam. × thickness 3 inch × 2 mm, 99.95%
7440-22-4
Silver sputtering target, diam. × thickness 57 mm × 1.0 mm, 99.99%
7440-22-4
Silver sputtering target, diam. x thickness 4 inch x 6 mm, 99.99%
7440-22-4
Silver sputtering target, diam. × thickness 2 inch × 0.125 inch, 99.99%
7440-22-4
Samarium cobalt alloy, sputtering target, diam. x thickness 50.8 mm x 1 mm (1:5%)
Tantalum, sputtering target, 99.95% (L x W x Thick 14 x 1 x 2 mm)
7440-25-7
Titanium sputtering target, diam. × thickness 50 mm × 5 mm, 99.99%
7440-32-6
Titanium sputtering target, diam. × thickness 2 inch × 3 mm, 99.99%
7440-32-6
Titanium sputtering target, diam. x thickness 25.4mm (1.0in) x 1 mm , 99.9%
7440-32-6
Titanium sputtering target, diam. × thickness 2 inch × 0.125 inch, 99.995%
7440-32-6
Tantalum, sputtering target, diam. x thickness 1 inch x 0.125 inch, 99.95%
7440-25-7
Tungsten sputtering target, diam. x thickness 1 inch x 0.125 inch, 99.95%
7440-33-7
Titanium sputtering target, diam. × thickness 1 inch × 4 mm, 99.99%
7440-32-6
Titanium sputtering target, diam. × thickness 250 mm × 3 mm, 99.95%
7440-32-6
Tantalum sputtering target, 99.95% (L x W x Thick 700 x 25.4 x 3 mm)
7440-25-7
Tungsten sputtering target, diam. x thickness 4 inch x 4 mm, 99.99%
7440-33-7
Titanium dioxide sputtering target, dia x thickness 3 inch x 5 mm, 99.99%
13463-67-7
Titanium nitride sputtering target, diam. x thickness 4 inch x 6 mm, 99.5%
25583-20-4
Tin sputtering target, 2 inch dia x 3 mm thick, 99.99%
7440-31-5
Titanium sputtering target, diam. × thickness 2 in. × 3 mm, 99.995%
7440-32-6
Titanium sputtering target, diam. × thickness 3 in. × 2.5 mm, 99.95%
7440-32-6
Tantalum pentoxide sputtering target, diam. x thickness 101.6 mm × 4 mm, 99.9%
1314-61-0
Titanium sputtering target, diam. x thickness 4 inch x 4 mm, 99.99%
7440-32-6
Tin sputtering target, diam. x thickness 3 inch × 3 mm, 99.99%
7440-31-5
Tantalum sputtering target 99.95% 3 inch dia x 2.5 mm thick
Tb(Fe0.45Co0.55) sputtering target 99.95% 3 inch dia x 1.5 mm thick
Titanium dioxide sputtering target, dia x thickness 3 inch x 3 mm, 99.99%
13463-67-7
Titanium sputtering target, diam. × thickness 3 inch × 5 mm, 99.99%
7440-32-6
Tantalum pentoxide sputtering target, diam. x thickness 304.8 mm x 10 mm, 99.99% elastomer bonding to Copper backing plate 304.8mm dia x 16 mm thick
1314-61-0
Tungsten sputtering target, diam. × thickness 2 inch × 0.125 inch, 99.95%
7440-33-7
Titanium sputtering target, diam. x thickness 4 inch x 6 mm, 99.995%
7440-32-6
Tungsten sputtering target, diam. × thickness 50 mm × 6 mm, 99.95%
7440-33-7
Tungsten sputtering target, diam. × thickness 2 inch × 3 mm, 99.9%
7440-33-7
Tantalum sputtering target dia x thickness 2 inch × 1 mm, ≥99.95%
Vanadium sputtering target dia x thickness 2 inch × 1.5 mm, ≥99.9%
Vanadium sputtering target, diam. × thickness 2 inch × 0.125 inch, 99.95%
7440-62-2
Yttrium sputtering target, diam. × thickness 2 inch × 0.125 inch, 99.99%
7440-65-5
Zinc sulphide (backing plate copper) sputtering target, diam. x thickness 50 mm × 5 mm, 99.9%
1314-98-3
Zirconium sputtering target, diam. x thickness 50.6 mm x 3 mm, 99.99%
7440-67-7
Zinc sputtering target, diam. x thickness 50.6 mm x 3 mm, 99.99%
7440-66-6
Zinc sputtering target, diam. x thickness 4 inch x 6 mm, 99.995%
7440-66-6
Zinc oxide sputtering target, diam. × thickness 2 inch × 2 mm, 99.9%
1314-13-2
Zirconium sputtering target, diam. × thickness 2 inch × 0.125 inch, 99.95%
7440-67-7
Zinc sulphide (backing plate copper) manganse doped, sputtering target, diam. x thickness 50 mm × 5 mm, 99.9%
1314-98-3
Zinc oxide sputtering target, diam. × thickness 50.8 mm × 3 mm, 99.9%
1314-13-2
Zirconium sputtering target, diam. x thickness 25.4 mm x 1 mm, 99.9%
7440-67-7
Zinc sputtering target, diam. x thickness 2 inch x 0.125 inch, 99.99%
7440-66-6
Antimony(III) oxide, 99.999% (metals basis)
1309-64-4
Antimony(III) oxide, < 2 μm, 99.9%
1309-64-4
Copper(I) iodide, 99.999%
7681-65-4
Germanium(IV) chloride, 99.9999%
10038-98-9
Iron boride, 1-10 mm, 99.99%
12006-85-8
Lithium acetate, 99.999%
546-89-4
Lead(II) chloride, 99.999%
7758-95-4
Lithium acetate, 99.95%
546-89-4
Lead(II) bromide, 99.999%
10031-22-8
Lead(II) iodide, 99.999%
10101-63-0
Nickel boride, 99.99%
12007-01-01
Potassium gold(III) chloride, 98%
13682-61-6
Tellurium oxide, ≥97%
7446-07-03
Tellurium oxide, 99.9995%
7446-07-03
Tellurium tetrachloride, 99%
10026-07-0
Zirconium(IV) oxide, 99.95%
1314-23-4
Zirconium(IV) oxide, 99.978%
1314-23-4
Zirconium(IV) oxide, 99.997%
1314-23-4
YBCO disk, dia 28 mm, thick 10 mm
YBCO disk, dia 44 mm, thick 14 mm
YBCO disk, dia 60 mm, thick 20 mm
YBCO Disk, (60 mm x 30 mm x 20 mm height)
YBCO disk, dia 50 mm, thick 10 mm
YBCO disk, dia 30 mm, thick 12 mm
YBCO Disk, (40 x 40 x 10 mm height)
YBCO disk, dia 50 mm, thick 15 mm
YBCO disk, dia 14 mm, thick 10 mm
Google Sites
Report abuse